In addition to these memory chips, the industry is still developing various new generation chips, such as MRAM magnetoresistive memory, ReRAM resistive memory, PCRAM phase change memory (IntelThe arrogant memory is the principle of phase change storage. The characteristics of these chips are that they combine the advantages of flash memory and memory. They are fast, have low latency, high reliability, and can save data when power is off. However, these three types of chips have the same The shortcoming is that the capacity is relatively small and manufacturing is difficult.
In order to solve the production problems of the new generation of memory chips, new semiconductor equipment is needed. In this regard, Applied Materials is once again in the forefront of the world. Recently, the company announced the launch of Endura production platform, including Endura for manufacturing PCRAM and ReRAM. Impulse PVD and Endura Clover PVD for MRAM are two of the most sophisticated chip fabrication systems ever developed by the company.
Taking Endura Clover PVD as an example, Applied Materials said it consists of nine wafer processing chambers, all integrated in a vacuum and pure state, which is the industry's first mass-produced 300mm MRAM system. Each reaction chamber can deposit 5 different materials, and the MRAM chip requires at least 30 different material deposition operations. Some of the material deposition layers are 500,000 times smaller than human hair, achieving subatomic accuracy. The process is extremely complex and extremely precise.
The same is true for Endura Impulse PVD devices that manufacture ReRAM and PCRAM, as well as ultra-complex, sophisticated semiconductor devices.