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IPhone 11 Pro Max detailed disassembly of double layer ultra small motherboard

via:MacX     time:2019/9/21 10:51:39     readed:3442


Apple Online Store (China)

First, let's take a look at the basic information of the iPhone 11 Pro Max:

A13 Bionic SoC, Integrated Third Generation Neural Network Engine

6.4 inch (2688 x 1242) 548 PPI superretinal XDROLEDDisplay screen, supporting original color display and HDR (3D Touch removed)

Rear 12 million 3-camera (ultra wide angle, wide angle and long focus), 12 million front-end cameras, and TrueDepth FaceID hardware

64GB onboard flash memory (256GB and 512GB optional)

Gigabit LTE, WiFi 6, Bluetooth 5.0, NFC

IP68 waterproof and dustproof

Before disassembly, X-ray to check the internal situation

From left to right are the iPhone XR, the iPhone XS Max and the iPhone 11 Pro Max.

The battery of the iPhone 11 Pro Max is a single L-cell, just like last year's iPhone XS.

The size of the motherboard seems to be further reduced, leaving room for the three cores

Unscrew the bottom screw

Open with tilting and opening device



althoughApplePromoting this year's iPhone 11 Pro Max is better waterproof, but the adhesives around the screen are basically the same as last year's.


The Inside of the iPhone 11 Pro Max


Huge L-shaped batteries are connected to the motherboard through two connectors? This is a new design.

Adding a cable may support reverse wireless charging


Three postphotos


Front-end Face ID sensor, cable no longer folded under the battery, easy to disassemble



Three camera components, each lens has its own wiring



Continue to dismantle the motherboard


It's much smaller than the iPhone XS motherboard. The iPhone 11 Pro is almost the same as the iPhone 11 Pro Max motherboard.


Still a two-tier motherboard, to separate



When you open it, you can see the A13 chip.


Chips on the motherboard include


Red: Apple APL1W85 A13 bionic SoC, above is also SK Hailishi H9HKNNCRMMVDR-NEH LPDDR4X

Orange: Apple APL1092 343S00355 N018K600AL 01930

Yellow: Cirrus Logic 338S00509 Audio Decoder

Green: Unmarked USI Packaging Chip - Probably U1 UWB Chip

Blue: Avago 8100 medium/high frequency PAMiD

Purple: Skyworks 78221-17 Low Frequency PAMiD

Pink: STB Microlectronics STB601A0N Power Management IC

More chips:



Red: USI 339S00648 80753109

Orange:IntelX927YD2Q Modem (Baseband Chip)

Yellow: Intel 5765 P10 A15 08B13 H1925

Green: Skyworks 78223-17 PAM

Blue: 81013 - Qorvo Envelope Tracking

Purple: Skyworks 13797-19 5648169 1927 MX

Pink: Intel 6840 P10 409 H1924




Finally, the red one isToshibaTSB 4226VE9461CMNA1 1927 Flash Memory

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