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Qualcomm announces a new generation of 3D ultrasonic fingerprint: 17 times larger recognition area

via:快科技     time:2019/12/4 7:00:26     readed:25

At the Xiaolong technology summit, in addition to the new generation of Xiaolong 865 and Xiaolong 765 / 765G 5g mobile platforms, Qualcomm also brought a new 3D ultrasonic fingerprint recognition technology.Qualcomm's new generation of ultrasonic fingerprint sensors is called 3D sonic max. It supports 17 times the recognition area of the previous generation, and can support two fingers to conduct fingerprint authentication at the same time, which further improves the security, as well as the unlocking speed and ease of use.

Verizon and Vodafone are among the first operators to announce support for the snapdragon modular platform certification program, and more operators are expected to join the program in 2020.

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