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See the largest chip: 1.2 trillion transistors, 400000 cores

via:博客园     time:2019/12/8 0:07:38     readed:156


Original title: the first computer chip with a trillion translators it should speed up calculations for artistic intelligence

NetEase Technology News, December 7 news, according to foreign media reports, a few days ago in Los Altos, California, Cerebras officially released a supercomputer called CS-1, the core of which is the use of 16nm process technology, wafer size processor array. The company names the 21.5 cm * 21.5 cm silicon board as WSE,.

It is reported that a high-end modern computer chip may have billions of transistors. But WSE has more than 1 trillion transistors. In addition, the 400000 cores loaded by WSE can transmit 9000 trillion bytes of data per second; compared with the current Intel i9-9900k chip configured for personal computers, there are only eight cores that can transmit 40 billion bytes of data per second.

The supercomputer CS-1 is also very small. At present, the world's fastest supercomputing summit has about 2.4 million cores. But summit uses a traditional structure, using a heavy-duty circuit board, which weighs more than 340 tons and covers an area of 520 square meters. The weight of CS-1 is only 50 kg, which is the same size as the household refrigerator. In terms of energy consumption, summit supercomputers consume 1000 times more power than CS-1. It also consumes only 15-20 kilowatts of electricity. The peak requires 1000 times more energy.

CS-1 supercomputer is mainly used in artificial intelligence operations such as machine learning. Its compiler has been optimized to make the data transfer between cores as efficient as possible. CS-1 compiler improves the transmission efficiency by matching the generated code structure with the hardware structure. In addition, since the kernel locations on WSE are only a few millimeters away from the memory they use, data flow from one part of the board to another is much faster than usual.

The wafer level integrated semiconductor device itself is manufactured by TSMC. TSMC's manufacturing process is very precise, with only 150 to 200 defects per semiconductor device. Given the number of other transistors available, these are easy to ignore. Of course, there are many other challenges for wafer level integrated devices, such as data synchronization, power supply, heat dissipation and data transmission effectiveness. However, if CS-1 can be successfully commercialized, the wafer level integrated semiconductor devices will finally prove themselves. (Chen Chen)

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