After the launch of 7Nm and 7Nm EUV processes, TSMC will be in the lead in mass production of 5nm processes this year. In the first half of this year, the production capacity will reach 10000 Wafers / month, but the peak of shipment is Q3, and the production capacity will be increased to 70000-80000 Wafers / month, mainly for apple and Hisilicon.
5nm will be another important process node of TSMC, which is divided into N5 and n5p versions. Compared with n7nm, the former has 15% improvement in process performance, 30% reduction in power consumption, 80% increase in transistor density, and the latter has 7% improvement in performance and 15% reduction in power consumption based on the former.
According to previous reports, TSMC's 5nm process is progressing smoothly,At the end of last year ,The average yield on the test chip is 80%, up to 90% However, these chips are relatively simple. If they are placed on complex mobile and desktop chips, the yield rate is not so high, but the specific data is not disclosed.
The 5nm process will be mass produced in the first half of this year, but the capacity is limited at this stage, with only 10000 Wafers / month. In the second half of this year, with the shipment peak of apple and Huawei,5nm capacity will also expand to 70000-80000 Wafers / monthfor the end of the Q3 quarter and the Q4 quarter for the launch of the iPhone 12, Mate 40 and other new machines.
Although the process technology is more and more advanced, the cost of TSMC's 5nm process is also rising,The cost of developing a chip will be $540 millionAt about 4 billion yuan in R & D costs, only big customers like Huawei and Apple can afford to burn their Kirin 1020 and A14 chips.
There is AMD, but AMD will still use 7nm and 7nm processes in 2020, and at least the Zen4 architecture of the 5nm process will not be possible until 2020.