Intel's catch-up with the 10 nm process is back on schedule, but the 7Nm process has been delayed for half a year, leading to changes in the GPU plan.It is reported today that Intel is ready to book TSMC's 180000 wafer capacity at 6nmBut after the production, we still need to use Intel's own packaging factory. This part is not planned to be outsourced.
Intel is not without outsourcing products. It has been outsourcing baseband chips and chipsets before, but the outsourcing products are mainly low-end products, and the economic and technical value is not high,Intel has always been used to its own design, production and packaging.
Due to its 7Nm delay, Intel's high-performance Xe for HPC may be produced by TSMC's 6nm process. It is reported that Intel has scheduled 180000 wafer capacity, which is not a small proportion,If a 12 inch wafer only produces 100 GPU chips, it will be nearly 20 million GPU chips, which shows Intel's confidence in GPU.
However, Intel's outsourcing plan is somewhat different. This time, it is not completely outsourced, but the production is handed over to TSMCThe packaging test still needs to return to Intel's own packaging factory, rather than to the professional packaging and testing factory according to the outsourcing practice.
In the three links of chip design, manufacturing and packaging, packaging is actually the link with the lowest value and the lowest technical requirements. Outsourcing can save money and worry. However, Intel also has a large packaging test capacity, so it seems that this process is not prepared for outsiders.