Future 5g iPhone models may use larger batteries or more compact battery modules than existing phones, thanks to Apple's key integration technologies, which were first seen in the company's airpods Pro wireless headset.DIGITIMES reported today that apple is looking for a combination of system level packaging (SIP) and flexible printed circuit board (FPCB) in the upcoming 5g iPhone Battery module to replace the existing rigid flexible PCB solution that has been relied on for many years.
According to the source,Apple SiP FPCB programme has been integrated into its new AirPods series and may be applied to five G. ContentsiPhoneBattery modules, in part because SiP can integrate a variety of functions and allow more components to have more space. now, because apple successfully controls the cost, SiP FPCB can match the hard flexible circuit board scheme well in terms of cost performance.
Kuo has previously said that Apple plans to launch a new entry-level airpods in the first half of 2021, similar in shape to the airpods pro. The airpods pro, launched in 2019, has a different in ear design from the airpods, with a shorter handle under the ear.
The third generation of airpods is expected to adopt more compact SIP technology, similar to the internal structure of airpods pro, which will integrate the audio functions of airpods into a shell more similar to the airpods pro design.
the current rigid-flex board supplier iPhone battery modules may be greatly affected if apple decides to adopt similar SiP FPCB solutions on the new iPhone 2021.