In order to let you have a more comprehensive understanding of Apple iPhone 12 MagSafe magnetic suction wireless charger, we cooperate with CNAs authorized chip analysis laboratory Xi'an semiconductor power device test and application center to conduct chip level analysis on MagSafe magnetic suction wireless charger.
Xi'an semiconductor power device testing and Application Center is a third-party laboratory authorized by CNAs. The laboratory is composed of four departments, namely, semiconductor testing laboratory, which mainly tests the dynamic, static and thermal parameters of semiconductors; the semiconductor failure analysis laboratory mainly conducts failure analysis of various semiconductor devices; and the semiconductor reliability laboratory mainly includes all kinds of semiconductors It provides comprehensive reliability testing and evaluation for bulk devices, and semiconductor application laboratory is mainly engaged in system level application, testing and analysis of devices.
Apple MagSafe wireless charger box is still a typical Apple style design, white tone, square shape. The front of the box has Apple logo, MagSafe charger and product appearance drawing, which is very simple.
The paper slot is used to place the charging board inside the carton, and the paper jam in the middle is used to fix the cable. The whole package is all paper-based, which can be said to be a good embodiment of Apple's environmental protection action.
The main circuit of the iPhone 12 MagSafe magnetic suction wireless charger is composed of two parts: USB type-C wire head unit circuit and coil transmitting unit circuit. Whether it is the wire end part or the emission part, the whole charger is compact and small in size. The aluminum profile back shell is full of science and technology.
Appearance of emission part of coil
X ray diagram of coil transmitting part
From the Xray diagram of the emission part, it can be clearly seen that the ring magnet assembled by 16 NdFeB magnets can be seen clearly. At the same time, the coil, circuit board and the welding points of the coil are clearly visible.
Usb-c part appearance
Usb-c part X ray diagram
From the XRAY diagram, it can be clearly seen that the inductance, the welding point of the wire head, the circuit board and the output three capacitors, and the capacity is measured to be 22 after disassembly
After dissecting the USB type-C cable head unit, it is found that there are two main types of IC: Synchronous Boost IC and type-C interface control IC. Both IC packages are fc-bga (flip chip ball grid) This flip chip technology has better EMI characteristics and electrical performance than the chip of our commonly used wirebond packaging technology. At the same time, it can reduce the chip area of wirebond package chip by 30% - 60%. This packaging method is especially suitable for MagSafe magnetic suction wireless charger, which requires a very high product size. Therefore, the iPhone 12 The main control IC of MagSafe magnetic suction wireless charger is fc-bga packaged IC.
BOOST use TI IC, screen printing for 2 TI official website did not find the corresponding model, according to the pin function and packaging form speculated that the IC should be customized for Apple BOOST boost IC,TI the market version of the model is TPS61178, for internal integration of 2 16 m
Boost boost IC Xray diagram
Boost boost IC decap diagram
Combined with Xray, decap diagram, measurement on circuit board, tps61178 specification and other information, it can be confirmed that three vertical copper frames are power pins such as Vout, SW and GND of the IC. From the decap diagram with the frame removed, it can be seen that two synchronous boost MOS transistors are formed around the three conductive pins, and the control and protection circuits of IC are on the left and right sides.
The typical application of the TPS61178 is shown above, MagSafe the inductance of the magnetic suction wireless charger is 3.3 when used in practice
USB type-C controller adopts cypress cypd2104, which has been acquired by Infineon. Cypd2014 integrates 32-bit arm Cortex-M0 processor, supports a type-C port, and conforms to PD standard. BGA package, very small size.
Cypress cypd2104 Xray diagram
Typical application diagram of cypd2104 on cable
Cypd2104 decap diagram
In addition to the above two main control ICs, there are also two IC's on the boost wire head. The silk screen prints are 1324v and 2p. The appearance and anatomy of these two ICs are as follows:
Screen printed 1324v chip and screen printed 2p chip appearance
1324v Xray diagram
1324v decap diagram
1324v decap diagram
1324v from the picture of its decap, it has a large area of copper frame, the left part is probably two MOS, the right side is the chip circuit part, MOS tube is used for input over-voltage and over-current protection function, to protect the interface and subsequent components from damage.
2p Xray diagram
The screen printed 2p IC adopts the traditional DFN packaging form. The Xray image shows obvious line marking.
2p decap diagram
Decap image enlargement
Through the decap picture, we can see that this IC is from Anson, ncp715, low power and wide input LDO. Xdfn6 package, combined with silk screen information judgment is a 3.3V voltage regulator.
The coil transmitting part is composed of two parts, which are the connection authentication control part and the wireless charging coil transmitting part. From the anatomical picture before the charging head network, it can be seen that the two parts are respectively covered by shielding cover. Outside the wireless charging coil is the NFC coil. The control of the coil transmitting part adopts the chip of St Italy semiconductor. The transmitting chip of St official website in wireless charging direction is stwbc-mc, and the model of this dissection is stwpspa1, which should belong to the IC customized by st for apple.
The IC directly adopts WL-CSP wafer level chip scale Compared with the traditional packaging form, the package reduces the volume increase caused by the package to the greatest extent. The advantages of this packaging form are similar to those of fc-bga. The difference is that fc-bga is about the process of pin welding, while WL-CSP is from the perspective of the chip itself. The coil master IC is used in this package Stwpspa1 uses both fc-bga and WL-CSP technologies to minimize the volume of the chip package. MagSafe magnetic induction wireless charging device can maximize the volume advantage.
Stwpspa1 Xray diagram
Stwpspa1 decap diagram
From the decap diagram, we can see that two MOS transistors are built in the right side of stwpspa1 chip, and the two external MOSFETs constitute the H-bridge driving wireless charging coil.
The authentication chip of transmitter also adopts st chip, which is stm32f446mey6, which is used to connect authentication and other protection and control functions of wireless charger.
Stm32f446mey6 is ST's high performance basic series arm cortex-m4 MCU with DSP and FPU. Its package also adopts WL-CSP package to reduce package volume. Stm32f446mey6 also adopts fc-bga and WL-CSP packaging technology. The difference is that the chip surface is coated with a layer of black coating to protect the chip.
Stm32f446mey6 Xray diagram
Stm32f446mey6 power supply is a MPS step-down chip, synchronous rectification, dfn-8 packaging.
X ray diagram of MPS buck chip
There are two MOS tubes next to the transmitting coil, which are packaged in dfn3 * 3 and screen printed as 06 OBU.
06 OBU Xray diagram
06 OBU decap diagram
06 OBU decap diagram
These two MOS adopt the traditional frame drawing process, and the structure of the frame, wafer and wire can be clearly seen from the picture.
The circuit design of apple MagSafe magnetic suction wireless charger is complex and small in size. The main control IC adopts fc-bga flip chip technology, and the IC of transmitting coil also adopts WL-CSP technology, so as to minimize the volume of circuit part of MagSafe magnetic suction wireless charger.
The latest wireless charging technology is not only adopted in the system level design of the iPhone 12 MagSafe magnetic suction wireless charger, but also advanced semiconductor devices are used in the chip selection. At the same time, a number of customized IC are used in the charger. The whole product has compact structure, excellent texture and full sense of science and technology.
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Link to the original text:Charging head network