In the foundry market, the only competitor that can compete with TSMC is Samsung (Intel's high-profile entry remains to be seen), and the two sides are also mutually exclusive in advanced process progress, chasing each other at 7nm, 5nm, 3nm and 2nm.
At the latest Samsung Foundry Forum 2021, Samsung revealed its latest process progress and roadmap.
FinFET transistor architecture potential is almost exhausted, Samsung's next step is GAA surround grid, 3NM in two versions, 3GAE(low power version) will go into mass production in early 2022, 3GAP(high performance version) in early 2023.
Compared to 5nm, Samsung's new 3nm GAA reduces area by 35%, improves performance by 30% at the same power consumption and reduces power consumption by 50% at the same performance.
The 2nm process is not on the public roadmap, but MoonSoo Kang, Samsung's senior vice president of foundry marketing strategy, revealed that the 2GAP process will be in mass production by 2025.
This is the first time That Samsung has revealed plans for the 2nm process, but Samsung has also warned that the progress of the new process depends on customer planning and deployment, so we speculate that 2026 May be a more reasonable time to see Samsung 2nm process products on the market.
TSMC's 2nm process is expected to be mass-produced by 2024, about a year ahead of Samsung.