On November 17, Fast Technology was informed that Apple broke the newsmade, and Guo Mingqi, Tian Feng International analyst, released the latest development.The report pointed out that both the iPhone 14 supports Wi-Fi 6E with apple headers, which is expected to drive more competitors using Wi-Fi 6E.

Previously, Guo Mingxi has predicted thatWi-Fi 6 / 6e / 7 is the key to the Yuan Cosmic unit, the Wi-Fi supply chain is the main winner of the potential market for billions of heads in 10 years.

Guo Mingqi pointed out in the previous report that the current mobile phone and notebook computer models support only 5% models support the latest Wi-Fi 6, because mobile phone and notebook computer users are supported Wi-Fi 6 has no sense. However, the head wear display device requires the latest Wi-Fi specifications if you want to optimize the wireless experience.

Wi-Fi 6 / 6e / 7 and 5G mm wave is the connection technology of the most suitable headset display device. Considering the battery life, predict 2 & ndash; 3 years, most wireless head-wearing display devices will only support the latest Wi-Fi specifications. 2 & ndash; After 3 years, the high-end head wear display device will be equipped with the latest Wi-Fi specifications and 5G millimeters.

Guo Mingqi, predicting Meta, Apple and Sony is the largest brand in the market of 2022 universe equipment.

Meta, Apple and Sony will launch new head wearing display devices at 2H22, 4Q22 and 2Q22, respectively.Meta and Apple's new models support Wi-Fi 6e, Sony's PS 5 VR device supports Wi-Fi 6.

According to reports, the number of bands supported by Wi-Fi 6e is 2 & ndash; 3 times. If the 3x3 / 4x4 miMo is designed, 2 & ndash; 4 LTCC is required for each frequency, then Wi-Fi 6e's LTCC usage Wi-Fi 6 more 10 & ndash; 20 or more. This will supply the LTCC in 2022 possible to tend to be tense.

Further reading:

LTCC (Low Temperature Co-Fired Ceramic LTCC) technology is low-temperature co-burning ceramic technology, is an advanced passive integration and hybrid circuit packaging technology.

It can encapsulate three passive metaders, including resistors, capacitors, and inductors, and their various passive components (such as filters, transformers, etc.) in multi-layered wiring substrates, and with active devices (eg: Power MOS, Transistor, IC Circuit Module, etc.) The common set is a complete circuitry.