According to industry insiders, as chip suppliers (including Broadcom, Intel, MediaTek and Qualcomm) accelerate the development of Wi-Fi 7 chip solutions, the demand for QFN packaging and aging testing will rise.
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The Electronic Times quoted the person as saying,Chip manufacturers are expected to use 7nm/6nm process nodes to fabricate Wi-Fi 7 core chips in QFN packages and undergo burn-in testing, so that OSAT such as Riyueguang, Licheng, Jingyuandian and Silicon Grid can obtain lucrative business opportunities from the upgrade of wireless communication technology from the end of 2022 or the beginning of 2023.
In 2022, Wi-Fi 6/6E is expected to become a mainstream wireless communication specification, and top chip manufacturers are shifting the focus of production to Wi-Fi 6/6E core chips to improve the ASP of Wi-Fi SoCs under the premise of tight foundry capacity. Laptops, desktops and phones are expected to fully support Wi-Fi 6/6E applications, the sources added.
MediaTek's packaging and testing partners (including OSAT Jingyuandian and Silicon Grid, test interface suppliers Zhonghua Jingji, Yingwei Technology, and Keystone Microtech) have seen clear orders in the third quarter of 2022, and they will continue to provide capacity support to major chip manufacturers in Taiwan and other regions.
Sun Moonlight expects to see significant orders from Broadcom and Qualcomm Wi-Fi SoCs and other chip solutions in 2022. Riyueguang and Chaofeng are also expected to receive orders for Wi-Fi SoC QFN packages from Intel, and Licheng and Kyosun will share an order for aging testing from Intel.
At the same time, specialized third-party IC testing and certification plants, including Genxing, Best Testing Lab, and Audix, are expanding lab capacity for Wi-Fi 6/6E chipsets, which are increasingly being used in business and gaming laptops in addition to mobile phones and other end-consumer electronic devices.