On March 5, blogger @ibingyuzhou revealed on social media thatQualcomm's flagship processors for the second half of this year and next will be manufactured by TSMC,Power control will be better.
In accordance with qualcomm's naming rules, the company's flagship chip in commercial use later this year will be namedSnapdragon 8 Gen1 Plus, and next year's flagship processor will be named8 Gen2 Xiao dragonThey will all be manufactured by TSMC.
It's worth noting that,Qualcomm Snapdragon 888 and Snapdragon 8 Gen1 are manufactured by Samsung.
Before the industry insider @mobile chip expert broke the news, TSMC foundry yield is higher than Samsung. Take Snapdragon 8 Gen1 Plus as an example. Since the third quarter, snapdragon 8 Gen1 Plus has produced more than 50,000 pieces per quarter, and the current yield rate has exceeded 70%, much higher than the Snapdragon 8 Gen1 manufactured by Samsung.
Therefore, qualcomm Snapdragon 8 Gen1 Plus and Snapdragon 8 Gen2 are outsourced to TSMC, which may be due to Samsung's low yield.
In addition,Qualcomm has announced a new generation of 5G modem, the Snapdragon X70, the chip is likely to be integrated into qualcomm Snapdragon 8 Gen2.
It is reported that the Snapdragon X70 is the world's most complete SERIES of 5G modem and RF system products, providing terminal manufacturers with great flexibility to design terminals to meet the requirements of global operators.
What's more, the Snapdragon X70 supports 10Gbps 5G peak download speed and brings new advanced features such as Qualcomm 5G AI Suite, Qualcomm 5G Ultra Low Latency Suite and quad Carrier aggregation.
To sum up, as Qualcomm's most powerful 5G chip, THE Snapdragon 8 Gen2 manufactured by TSMC has a promising performance.