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AMD, Intel and other domestic chip manufacturers joined UCIe packaging Technology Alliance for the first time

via:快科技     time:2022/4/4 9:00:35     readed:199

Chiplets technology is a hot topic in recent years, and packaging different IP modules together can further improve the performance of chips. Before that, AMD and Intel also formed UCIe Industrial Alliance, and now Chiplets has become the first domestic chip manufacturer to join the alliance.

Xinyuan, a leading chip IP service provider in China, recently announced that it has officially joined the UCIe Industry Alliance.

As the first batch of enterprises in mainland China to join this organization, Xinyuan will work with other members of UCIe Industry Alliance to research and apply UCIe version 1.0 specification and the new generation of UCIe technical standards, laying a solid foundation for the development of Chiplet technology and products.

In March this year, UCIe(Universal Chiplet Interconnect Express) industry Alliance was formally established by ten companies including ASE, AMD, ARM, Google Cloud, Intel, Microsoft, Qualcomm, Samsung and TSMC. Consortium members will work together to standardize the Chiplet interface specification and have already released version 1.0 of the UCIe specification.

UCIe is an open Chiplet interconnection specification, which defines the interconnections between Chiplet within an encapsulation to achieve universal interconnection of Chiplet at the encapsulation level and an open Chiplet ecosystem.

The aim of the standard is to develop a new open standard for small chip interconnection, simplify the process and improve interoperability between small chips from different manufacturers.

AMD、Intel等组建UCIe封装技术联盟 国产芯片厂商芯原首次加入

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