According to Intel's chip process roadmap, by 2025, they will master the 5th generation CPU process in just 4 years. Among them, two generations are still entering the Emi -level process for the first time. The "4nm" process of the bidders is also the first process of Intel using the EUV lithography machine.

At present, TSMC and Samsung have already produced a 4nm process, but Intel's own "4nm" technology still has a lot of characteristics, especially in terms of performance, the other two mainly produce low -power chips. Intel is to produce high -performance processing Device, including desktop and server levels.

Intel's "4nm" process than the current Intel (that is, the second -generation 10nm process before the name) increases by 20%per tile. If it is compared with the previous 10nm process, the performance improves more than 35%.

In other respects, Intel's "4nm" transistor density of the process increases by 100%compared to the Intel 7 process, HP high -performance library density can reach 160 million crystal pipes/MM2, which is higher than the 130 million transistor/MM2 of TSMC 5nm process. The level of 208 million crystal pipes/MM2.

At present, the 12th generation Cores of Intel 7 and the 13th generation Core in the second half of the year can be 5.5GHz.Assuming that the performance is only increased by 20%, the limit frequency should be able to exceed 6GHz, and the unprecedented level should be unprecedented. I don't know if Intel will do this.

The Intel 4 crafts will start on the 14th generation Core METEOR LAKE next year, which will also be the first processor in the Intel Core series to use 3D FOVEROS hybrid packaging. It is the GPU module, as many as 96-192 computing units, and the third is SOC-LP. It should include input and output parts such as memory controller, PCIE controller.