Before the Taipei computer exhibition of Dr. Su Zifeng tomorrow in the afternoon, the X670 series motherboard that adapted to the Zen 4 Ryzen 7000 has been ran away in advance.
The leaked models are X670E Godlike, X670E ACE, X670E Carbon WiFi, X670P-WIFI, of which the X670E Carbon WiFi uses 18+2 phase 90A direct power supply, and the X670P-WIFI is a 14+2 phase 80A power supply.
In terms of interfaces, although there are no USB 4, HDIMI 2.1, DP 1.4 HBR (4K 120Hz), 2.5G network port, support Wi-Fi 6E, etc. are also very practical.
According to the current news, the first batch of Zen 4 Ryzen 7000 will include X670E (Extreme), X670 and B650 options,The perspective view confirms that the X670 is designed with dual -core (Shuangnan Bridge), and the B650 is a traditional single core. The dual core will obviously bring more fever, but the advantage is that it has the support of PCIE 5.0, I/O interfaces with more stable and more channels.