Original Title: Chiplet Concept Hits the White House? Biden spoke about what's behind Chiplet combing as he signed the chip bill
Cailianhe News, August 10 (edited by Liu Rui)U.S. President Joe Biden signed the Chip and Science Act into law on Tuesday, drawing global attention.
The Chip and Science Act, which has been getting a lot of attention recently, includes a $52.7 billion subsidy for the semiconductor industry and a restriction that prohibits companies receiving federal funds from increasing production of advanced process chips in China.
In addition to this, there is another detail worth paying attention to for secondary market investors: the fact that the term "Chiplet platform" was accidentally mentioned in the White House's relevant briefing. Does this have anything to do with the "Chiplet platform" concept that has been booming in the domestic secondary market recently?
Joe Biden also mentioned Chiplet? An unexpected A-share buzzword in A White House briefing
On Tuesday, after Mr. Biden signed the Chip and Science Act, the White House released a briefing on the situation.
In addition to outlining the contents and implications of the Chip and Science Act, the fact sheet notes that the President's Council of Advisers on Science and Technology (PCAST) issued new recommendations on semiconductor research and development,"Propose to develop Chiplet Platform, enabling startups and researchers to innovate faster and at lower cost."
The full proposal, published on PCAST's website, offers a glimpse of what the so-called Chiplet Platform will look like.
PCAST says in the paragraph "Fostering innovation,"
Fostering innovation: Developing a new semiconductor product requires an investment of hundreds of millions of dollars, a cost that many startups and academic researchers cannot afford. To reduce entry costs, we would recommend that a portion of the Chip and Science Act funding be used to provide financial support for startups and academic researchers, as well as the necessary access to prototype tools and facilities. Making these resources available can level the playing field and restore healthy competition to markets.
We will also propose the development of a "Chiplet platform" -- a chip that includes common, non-innovative parts of a product -- to enable startups and academic researchers to innovate faster and dramatically reduce their development costs.Other countries, particularly in Asia, are investing to reduce market entry costs and seeing results. For example, six times as many semiconductor startups are created in China each year as in the United States. We believe that investing in these domestic shared resources is essential to reverse this trend.
It can be seen that the Chiplet platform proposed by PCAST has nothing to do with the popular Chiplet technology itself in China.
The concept of Chiplet, which is popular in the domestic secondary market, refers to the packaging technology that encapsulates multiple module chips together with the underlying basic chip to form a system chip.
Chiplet itself is a high-performance, low-cost, fast-to-market solution that assembles multiple chips in a single package. thusAs a metaphor, PCAST suggested that the U.S. government build a platform that would allow startups to lower development costs and make it easier to get to market.
In fact, Chiplet technology is not a new concept. In the past few years, several international head chip design companies such as AMD, Intel, and TSMC, as well as several Chinese chip design companies, have demonstrated or implemented Chiplet design into their products. Thus, PCAST's mention of Chiplet in its proposal is not new either.