TSMC has confirmed that it will mass -produced 3nm processes in September, but the A16 processor used by Apple iPhone 14 series cannot catch up this year. It still uses TSMC's 5nm or an improved version of the 4nm process. too much.
The first -generation N3 process is mainly for early customers with super investment capabilities and pursuing new processes, such as Apple and AMD, but the application scope is narrow and only suitable for manufacturing specific products.
TSMC's 3nm process will be the second edition of the N3E process next year, that is, the 3nm Ehans enhanced version. On the basis of N3, improve performance, reduce power consumption, and expand the scope of application.Compared with N5, the power consumption is reduced by 34 % under the same performance and density, the performance of the same power consumption and density is increased by 18 %, or the transistor density can be increased by 60 %.
Although the density may be like the first generation of N3, the N3E process will be the main force used by the mass production of major manufacturers, including Apple’s new generation of processors.Such as the 17 processor of the iPhone 15, the M3 processor of the next generation, and AMD's future Zen5.
The N3E process is expected to mass production in the second half of 2023. This year, there will be trial production. The internal PPT that has been leaked recently shows that the N3E process of TSMC is progressing very well and good at good.
Among them, the yield of 256MB SRAM chips produced by N3E technology can reach 80%, the yield rate of mobile and HPC chips is also 80%, and the yield rate of ring oscillator can even reach 92%.
Of course, these are relatively simple chips. The high yield is also normal. The actual processor contains very complex circuit units. The yield must continue to polish. Essence