When it comes to EUV lithography, Intel has admitted that it was wrong in the past, allowing TSMC and Samsung to beat it. After all, Intel was one of the first semiconductor companies to develop the EUV process. Now Intel can catch up.
Intel 4 is the previous Intel 7nm process, the first time Intel used EUV lithography,The transistor density of the high performance library can reach 160 million transistors /mm2, which is twice the current Intel 7, higher than TSMC's 130 million transistors /mm2 for the 5nm process and close to TSMC's 208 million transistors /mm2 for the 3nm process.
Intel officials have been very optimistic about the progress of the Intel 4 process. They have said many times before that production will start by the end of this year, but what level of production will it be? Semiconductor players know that there is a big difference between risky trial production, small-scale production and large-scale production.
The latest news is that the Intel 4 technology is now in high volume production, which means that Intel is ready for commercial production.
The Intel 4 will debut with a 14-generation Core Meteor Lake processor, and will be released in Q4, with the product due out next year.
According to previous sources, the 14th-Gen Core will not only have upgraded Intel 4 technology and new architecture,It will also use multi-chip integrated packaging for the first time, with independent CPU, core display, input and output, and different manufacturing processes.
The CPU Tile module of Meteor Lake is produced by Intel 4 technology, the IOE Tile and SoC Tile modules are produced by TSMC with 6nm technology, and the Graphics Tile graphics module is produced by TSMC with 5nm technology. Another Base Tile is made using Intel's own 22nm process.
On the 14th generation Core,Intel has achieved five chips in one, incorporating four different logic processes.
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