In the past two years, AMD CPU and GPU graphics cards have turned to chiplets small chip architecture design, each chip is composed of different modules, which can reduce the difficulty of chip production, improve the yield and control the cost.

The chip contract manufacturing of AMD is mainly completed by TSMC, but the small chip packaging mainly depends on the domestic chip closed test company Tonfu Micropower. The company said today that through the advance layout of advanced packaging technologies such as multi-chip modules, integrated fan-out packaging, 2.5D/3D, etc.Can provide customers with a variety of Chiplet packaging solutions, and has mass-produced Chiplet products for AMD.

Tonfu Micropower also mentioned that at present, most of the world's top 20 semiconductor companies and the vast majority of domestic well-known integrated circuit design companies have become customers of Tongfu Micropower.

Through M & A, the company and AMD have formed the joint venture and cooperation model of ldquo; & rdquo;, and established a close strategic partnership.

AMD completes the acquisition of the global FPGA leader Cylins, realizing the omni-directional layout of CPU GPU FPGA. The two sides are highly complementary in customer resources, IP and technology portfolio, which is conducive to AMD's further development in the 5G, data center and automotive markets.

The company is the largest package test supplier for AMD, accounting for more than 80% of its total orders.In the future, with the integration of major customer resources getting better and better, the synergy will continue to benefit the whole industry chain.