Intel, under the leadership of its new CEO, Pat Kisinger, came up with IDM 2.0 strategy, which not only revised its manufacturing roadmap, aiming for five nodes in four years, but also opened its IFS foundry service to compete with Taiwan Semiconductor Manufacturing, Samsung and others.

It is known thatAccording to Intel, its Emi-level process nodes 20A (2nm) and 18A(1.8nm) have been released. In other words, the design has been finalized, that is, specifications, materials and performance targets have been completed.

In fact, Intel had previously planned to start production in the first half of 20A 2024 and the second half of 18A 2024, so the flow is on track.

In other exciting news,Intel's IFS foundry service already has 43 potential partners testing chips, including at least seven from the world's TOP10 foundry customers.

Of course, before 20A and 18A,Intel will also launch Intel 4 and Intel 3, among which Intel 4 was first released by Meteor Lake (14th-generation Core) in the second half of the year and comprehensively introduced EUV ultra violet lithography and new packaging technology, while Intel 3 mainly provides services for enterprise-class budget products.

The highlight of 20A is the RibbonFET transistor and PowerVia backside power supply technology, which improves the performance per watt by 15%.