Home of IT, March 7 news, Changdian Technology said in the investor interactive platform today that the company in 2021 private offering investment project is under construction, including annual output of 10 billion communication high-density mixedSome production lines of integrated circuit and module packaging project started small batch verification production。

The company pointed out that due to the repeated impact of the epidemic last year, the high inventory in the domestic communication consumer market and the downward pressure brought by the continuous adjustment of demand, the company took into account customer demand and market conditions and slowed down the construction progress of the two projects from a prudent perspective.

As IT Home reported, Changdian announced last weekFor more customers to provide 4D millimeter wave radar advanced packaging mass production solutionsTo meet the increasingly diversified needs of automotive electronics customers for customized development and technical services.

Data shows that Changdian technology is a finished chip manufacturing enterprise, focusing on the development of integrated circuit manufacturing and technical services, to provide customers with one-stop service for finished chip manufacturing. The previous technology of Chang Electrical Department showed thatThe company has realized the 4nm process of mobile phone chip packaging。

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"Changdian Technology to provide more customers with 4D millimeter wave radar advanced packaging mass production solutions: Support for L3 and above automatic driving"