Recently, domestic EDA manufacturer Jiulun Electronics said that the company's research and development of key EDA products, has supported 7nm/5nm/3nm and other advanced process nodes.

This means that there are currently two EDA manufacturers in China, whose EDA products support the most advanced technology of 3nm, and the other one is Huada Jiutian.

In fact, from the current situation, the domestic core has achieved 3nm in EDA, design and sealed test, reaching the world's leading level. Now only the manufacturing card is at 14nm, and the manufacturing is mainly stuck in the lithography machine.

Let's start with EDA. It has been mentioned before that EDA products of Huada Jiutian and Jiulun Electronics have achieved 3nm. However, it is important to note that not all processes have achieved 3nm, but only some products have reached this process.

However, once one part reaches the 3nm process and is used by the customer, it is easy for the rest of the process to reach 3nm.

Talking about the design, this should be the strength of domestic chip manufacturers, academician Ni Guangnan also said before, chip design ability, we and the world level is basically equal.

At present, there are not a few domestic manufacturers capable of designing 3nm chips, and Huawei is sure to be able to, there is no doubt about this. Kirin 9000 series is a 5nm chip, and chip design enterprises generally need to design chips at least 2 years in advance, which means that when the Kirin 9000 chip is launched, Huawei has begun to design 3nm chips.

In addition, when Samsung 3nm chip was mass-produced last year, the first customers were Chinese mainland customers, just some mining machine customers, but it also shows that the design level of 3nm has long been reached in China.

Finally, let's talk about closed test, which is one of the strengths of the semiconductor industry in mainland China. At present, there are four domestic closed test enterprises ranked Top10 in the world, which are Changdian Technology, Tianshui Huatian, Tongfu Micro Electricity and Zhilu closed test.

Changdian Technology, Tongfu Micro Technology and Tianshui Huatian have long stated that they have possessed the encapsulation capability of 3nm chip. Changdian Technology and Tongfu Micro Technology even stated that the encapsulation capability of 4nm Chiplet has reached the global leading level.

Visible, the current domestic chip short board or manufacturing, after all, the Chinese mainland's most advanced chip process is still in 14nm, compared with EDA, design, sealed test of 3nm, the middle also separated by 10nm, 7nm, 5nm, 3nm so 4 generations, the 4 generations in accordance with the normal development, but also 5-10 years to do, now also plus the ban, The time to catch up is unknown, maybe even 10 years.

The key reason why the manufacturing is so backward is the lithography machine. The resolution of domestic lithography is only 90nm, and the EUV of ASML and the advanced infiltrating DUV lithography machine can not be sold to China. Therefore, the domestic lithography machine really needs to make a breakthrough, otherwise the manufacturing will always be short, and this short plate will become the most critical restriction factor of Chinese core.