Lenovo announced that 8 million notebook products will use ldquo; silk aluminum & rdquo;5L52 material this year.
This new aluminum material was jointly developed by Lenovo Group and Chinalco Ruimin. According to the official statement, before the birth of ldquo; silk aluminum & rdquo; material, most of the aluminum-magnesium alloy plate grades in the standard GB/T 3190 followed the material numbers of the former Soviet Union, the United States and Japan, and have been in use for decades.
Up to now, the vast majority of notebook computer body materials are made of traditional aluminum-magnesium alloy 5052 series, which is based on aluminum and magnesium as the main additive, which has some inherent disadvantages, such as low gloss, rough feel, obvious material pattern and so on.
It is reported that in order to make such a material, the two sides took three years of research and development, made tens of thousands of samples, and finally achieved success.
Earlier, Wang Huiwen, vice president of Lenovo Group and chief quality officer of computers and smart devices, said that the adoption of low-temperature solder paste process will be the general trend of the electronics manufacturing industry, and Lenovo is willing to open this technology to all manufacturers free of charge. Jointly promote the green and sustainable development of the industry.
The main composition of the new low temperature tin paste is tin-bismuth alloy, the melting point is 138 ℃, and it is in a stable solid state when the melting point is lower than 138 ℃. The welding temperature of low temperature solder paste is 180 ℃, which is significantly lower than that of 250 ℃ welding at room temperature, so the thermal deformation of components is smaller and the quality of motherboard is more stable and reliable.
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