Home > News content

Domestic Chiplet small chip process stable mass production of 4nm process products have been shipped

via:快科技     time:2023/5/16 14:00:55     readed:97

May 16, 2015 -- Chiplet has become a key technology in the semiconductor industry in recent years as Moore's Law has slowed down. It can encapsulate multiple chips of different processes together. Domestic chip packaging companies have also made breakthroughs in this aspect.

Changdian Technology has reportedly entered stable mass production of its XDFOI Chiplet high density multi-dimensional heterogeneous integration seriesAnd synchronously realize the shipment of 4nm node multi-chip system integrated package products to international customers.

The Chiplet technology has made breakthroughs and has been applied in high performance computing, artificial intelligence and other fields, and will enjoy a wave of demand for AI computing power.

The details of which customers the company supplied with the 4-nm node chip package were not disclosed.Apple, Qualcomm, Samsung, Mediatek, AMD and NVIDIA are the major companies launching 4nm chips worldwide.

As previously reported, Changdian XDFOI technology can control the thickness of the organic rewiring stack intermediary layer within 50μm, and the center distance of the micro-bump is 40μm, achieving high density integration of various processes in thinner and smaller unit area, achieving higher integration, stronger module function and smaller package size.

At the same time, metal deposition can also be carried out on the back of the package, which can effectively improve the heat dissipation efficiency and enhance the electromagnetic shielding capability of the package according to the design needs, so as to improve the yield of the finished chip.

It is understood that Changdiantechnology gives full play to the technical advantages of this process, has been applied in high performance computing, artificial intelligence, 5G, automotive electronics and other fields, to provide downstream customers with a thinner appearance, faster data transmission rate, less power loss of finished chip manufacturing solutions.

国产Chiplet小芯片工艺稳定量产 国际客户4nm工艺产品已出货

translate engine: Youdao

China IT News APP

Download China IT News APP

Please rate this news

The average score will be displayed after you score.

Post comment

Do not see clearly? Click for a new code.

User comments