As of this week, the U.S. Chip Program Office has received more than 300 applications from semiconductor manufacturers, according to Bloomberg.

The number of applications from semiconductor manufacturers increased by more than 100 in just one month, the report said.

The Chip Program Office notes that applicants are spread across the semiconductor industry chain. A review of the statement by IT Home found that more than half of the applications came from the semiconductor manufacturing and back-end packaging industries.

The Chip Program Office receives applications and assists in the issuance of $52.7 billion (currently about 371.08 billion yuan) in semiconductor grants. Previously, it has made it clear that it will strictly examine applicants' qualifications. Semiconductor manufacturers applying for subsidies must submit detailed financial data, the planned objectives of the manufacturing scheme and capital investment plans to prevent the subsidy from being misused.