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TSMC announced the release of 3Dblox Open Standard 2.0, which simplifies 3D chip design

via:IT之家     time:2023/10/2 18:04:08     readed:93

Thanks to IT home netizens OC_Formula for the clue delivery!

IT Home October 2 news, according to Taiwan media "Business Times" reported that TSMC announced the next generation of the new 3Dblox 2.0 version of the open standard in OIP 2023 (Open Innovation Platform Ecosystem Forum). Lu Lizhong, deputy general manager of TSMC Design and technology platform, said that TSMC assists industry integration in an alliance way to help customers accelerate their leap into the new generation of AI.

According to the report, among the two major AI chip manufacturers, AMD's MI300 series has begun to import 3Dblox packaging architecture, and Nvidia's next-generation GPU B100 is expected to be imported in the second half of next year.

IC designers said that semiconductors are moving toward heterogeneous integration and small chip (IT home note: core) architecture, and TSMC's establishment of standards will make chip design more simplified and help improve industrial competitiveness.

Practitioners pointed out that the development of chips in the past walked on the track of Moore's Law, the key to the breakthrough of the process is the 2D level of miniaturizing technology, but with the arrival of the physical limit, semiconductor efficiency in order to break through, into a new stage of development of 3D stacking. After the 2.5D packaging process CoWoS was favored by Nvidia and the production capacity was in short supply, TSMC actively established an open standard for the next generation of packaging 3Dblox, which is expected to shorten the development process of customers from architecture to streaming chips.

TSMC Chairman Liu Deyin recently highlighted the 3D Blox standard. Last year, TSMC launched the 3Dblox open standard, which aims to simplify and modular 3D IC design solutions for the semiconductor industry.

Dr. Yu Zhenhua, deputy general manager of TSMC, revealed that TSMC develops various 3D IC technologies to make the distance between circuits closer and closer, "there is even a possibility in the future, so that two different chips grow together." He analyzed that the performance of the semiconductor industry has tripled in the past 15 years, and the trend will continue, which is equivalent to the TSMC curve of the global semiconductor industry to increase the chip performance by three times in 15 years.

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