Intel is actively promoting the "four years, five process nodes" plan, will be completed in 2024-2025 20A, 18A process, respectively equivalent to 2nm, 1.8nm, especially the latter is expected to overtake TSMC, regain the lead.
In this regard, TSMC naturally will not sit idly by, and is very confident in its own technology.
TSMC President Wei Che-jia claimed that according to internal evaluation, TSMC N3P 3nm process can be comparable to Intel 18A in terms of performance, and launched earlier, more mature, and more cost-effective.
He also stressed,TSMC's 2nm process is more advanced than Intel's 18A and will be the most advanced process when it launches in 2025.
The Intel 20A/18A will introduce the RibbonFET, a fully wrap-around gate transistor, and the back-powered PowerVia.
TSMC's N3/N3E/N3P/N3X 3nm series is still a traditional FinFET transistor, and GAA fully surround transistors will be installed on the 2nm process.
The N2 version is scheduled for mass production in the second half of 2025, and the N2P version is scheduled for mass production by the end of 2026.
In the past third quarter, 5nm processes contributed 37% of TSMC's revenue, far ahead of other nodes, followed by 7nm 16%, 28nm 10%, and 16nm 9%.
3nm generated about $1.03 billion in revenue for TSMC for the first time this quarter (thanks to Apple).
In contrast, the 5nm process generated about $970 million in revenue for the first time commercially in the third quarter of 2020, accounting for about 8%.