Fast science and technology news on November 21, according to a check by enterprises, recentlyFast science and technology news on November 21, according to a check by enterprises, recently
Patent summary displayThe invention relates to the technical field of chip manufacturing.
The method includesThe silicon-based Cu/SiO2 mixed bonded samples and diamond-based Cu/SiO2 mixed bonded samples were prepared and then treated by plasma activation, and the Cu/SiO2 mixed bonded samples were soaked in organic acid solution, cleaned and then dried.
The silicon-based Cu/SiO2 mixed bonded samples and diamond-based Cu/SiO2 mixed bonded samples were prepared and then treated by plasma activation, and the Cu/SiO2 mixed bonded samples were soaked in organic acid solution, cleaned and then dried.
The invention realizes the three-dimensional heterogeneity integration of silicon / diamond based on Cu/SiO2 mixed bonding.
It is reported that the patent will be applied for publication on October 27, 2023. Affected by this, the concept of nurturing diamonds has increased by more than 16%.
User comments